Daeduck Electronics Pours Additional 497 Billion Won into Semiconductor Substrate Expansion

Daeduck Electronics is significantly accelerating its investment in semiconductor substrate production, committing an additional 497 billion won to expand manufacturing facilities and supporting infrastructure. The latest move, announced on July 20, comes just two months after the company revealed a 213 billion won investment in May, underscoring its aggressive push to capture rising demand in the AI and high-performance computing markets.

The new investment, which will run through December 31, 2027, is equivalent to 55.39% of the company’s shareholders’ equity. Daeduck Electronics stated that the funds, sourced from internal cash reserves and external borrowings, are intended to increase production capacity for semiconductor products and bolster related infrastructure. With this latest commitment, the company’s cumulative investment in semiconductor substrate production since 2020 has reached approximately 1.3 trillion won.

This capital deployment builds on a series of strategic expansions. Between 2020 and 2022, Daeduck Electronics invested roughly 270 billion won to establish production capacity for flip-chip ball grid array (FC-BGA) substrates. In 2022, it approved another 270 billion won for FC-BGA production, with that project now scheduled for completion in 2027. In 2025, the company invested approximately 50 billion won to expand multilayer board (MLB) output at its Ansan facility. Most recently, in May 2026, it announced a 213 billion won plan to build a new flip-chip chip-scale package (FC-CSP) manufacturing plant at its B1 Center in Siheung, Gyeonggi Province, also targeting completion by the end of 2027.

Industry sources indicate that Daeduck Electronics is accelerating its long-term capacity expansion as demand for high-value semiconductor substrates continues to climb, fueled by rising investment in AI servers and data centers. FC-BGA substrates are critical components in high-performance packages for AI accelerators, central processing units (CPUs), and graphics processing units (GPUs). FC-CSP substrates are primarily used in mobile application processors (APs), communications chips, and power semiconductors, while MLBs serve as key components for AI servers and networking equipment. The company appears well-positioned to benefit from the ongoing shift toward advanced packaging technologies required by next-generation computing.

Daeduck Electronics reported consolidated revenue of 346.3 billion won and operating profit of 51.3 billion won for the first quarter, with revenue surging 60.8% year-over-year. According to market consensus from FnGuide, second-quarter expectations stand at 370 billion won in consolidated revenue and 58.7 billion won in operating profit. Analysts expect the company to sustain its growth trajectory, supported by higher sales of AI server substrates and an improved product mix.